Title:
HOLLOW RESIN PARTICLE FOR HEAT-SENSITIVE RECORDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/189653
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a hollow resin particle for a heat-sensitive recording material, with which a heat-sensitive recording material having excellent sensitivity and fineness can be manufactured. This hollow resin particle for a heat-sensitive recording material is configured from an outer shell part comprising a thermoplastic resin and a hollow part enclosed in the outer shell part, the hollow resin particle containing a hydrocarbon that is evaporated by heating, and the inclusion ratio of the hydrocarbon being 0.2 wt% or greater. The volume-average particle diameter is preferably 0.1 to 10 μm.
Inventors:
SAKABE KOICHI (JP)
MIKI KATSUSHI (JP)
MIKI KATSUSHI (JP)
Application Number:
PCT/JP2020/011586
Publication Date:
September 24, 2020
Filing Date:
March 17, 2020
Export Citation:
Assignee:
MATSUMOTO YUSHI SEIYAKU KK (JP)
International Classes:
B41M5/44; B01J13/18
Domestic Patent References:
| WO2005049698A1 | 2005-06-02 |
Foreign References:
| JP2008062527A | 2008-03-21 | |||
| JP2008062537A | 2008-03-21 | |||
| JP2003341236A | 2003-12-03 | |||
| JP2005074984A | 2005-03-24 | |||
| JP2012224056A | 2012-11-15 | |||
| JP2009279943A | 2009-12-03 | |||
| JPH06340174A | 1994-12-13 | |||
| JPS62201231A | 1987-09-04 |
Other References:
See also references of EP 3943312A4
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