Title:
ADHESIVE CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2021/025003
Kind Code:
A1
Abstract:
The objective of the present disclosure is to provide a paste which can be printed without unevenness by suppressing a fluctuation in viscosity at printing temperature, and which is rapidly sintered even in a gas atmosphere such as nitrogen to form a highly precise conductive wire or a bonding structure having excellent bonding strength. The present disclosure provides an adhesive conductive paste which includes conductive particles and a solvent, and is for forming a conductive wire and/or a bonding structure to be connected to an electronic element. The adhesive conductive paste includes: silver particles (A) which are conductive particles and have an average particle diameter of 1-100 nm (exclusive of 100); and silver particles (B) having an average particle diameter of 0.1-10 μm, wherein the silver particles (A) each have a structure in which the surface thereof is coated with an amine-containing protective agent, and the solvent includes a compound (C) represented by formula (I): Ra-O-(X-O)n-Rb (I) (in the formula, Ra represents a monovalent group selected from a hydrocarbon group having 1-6 carbon atoms, and an acyl group. X represents a divalent group selected from a hydrocarbon group having 2-6 carbon atoms. Rb represents a hydrogen atom or a monovalent group selected from a hydrocarbon group having 1-6 carbon atoms and an acyl group. Ra and Rb may be the same group. n represents an integer of 1-3).
Inventors:
KOBATAKE TAKANORI (JP)
EGAWA TOMOYA (JP)
AKAI YASUYUKI (JP)
EGAWA TOMOYA (JP)
AKAI YASUYUKI (JP)
Application Number:
PCT/JP2020/029758
Publication Date:
February 11, 2021
Filing Date:
August 04, 2020
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
H01B1/22; H05K3/10
Domestic Patent References:
| WO2015163076A1 | 2015-10-29 | |||
| WO2017038572A1 | 2017-03-09 |
Foreign References:
| JP2019145510A | 2019-08-29 | |||
| JP2009170277A | 2009-07-30 |
Other References:
YI LIC.P. WONG: "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications", MATERIALS SCIENCE AND ENGINEERING, vol. R51, 2006, pages l-35
Attorney, Agent or Firm:
GOTO & CO. (JP)
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