ADHESIVE FILM, ADEHSIVE FILM WITH SUPPORT SHEET, CURED BODY AND METHOD FOR PRODUCING STRUCTURE

WIPO Patent Application WO/2022/097442

A1

An adhesive film 1 which is formed of an adhesive resin composition that contains (A) a thermally conductive filler that is composed of at least one of a graphene having a two-dimensional structure and a single-walled boron nitride, (B) a thermosetting component and (C) a binder polymer, and which is used in a heating process that comprises a preliminary heating step and a complete curing step wherein the adhesive film 1 is completely cured after the preliminary heating step. In the preliminary heating step, the adhesive film 1 is held at a temperature that is not more than the temperature (T) descried below for 30 minutes or more.　Temperature (T): a temperature at which the adhesive film 1 has a 0.5% weight loss if an adhesive film 1 before an arbitrary heating process is subjected to a thermogravimetric measurement wherein the adhesive film 1 is heated from 40°C to 400°C at a heating rate of 10°C/minute in the ambient atmosphere　This adhesive film 1 exhibits excellent thermal conductivity.

ICHIKAWA ISAO (JP)
YOSHINOBU TAKEO (JP)

PCT/JP2021/038057

May 12, 2022

October 14, 2021

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LINTEC CORP (JP)

C09J11/04; C09J7/35; C09J11/08; C09J163/00; C09J201/00; H01L23/373; H05K7/20

WO2020085316A1

2020-04-30

KR20130086902A	2013-08-05
CN110982457A	2020-04-10
CN109868085A	2019-06-11
CN110951409A	2020-04-03
JP2016189412A	2016-11-04
JP2015034269A	2015-02-19
JP2013256574A	2013-12-26
JP2000290617A	2000-10-17
JP2006124607A	2006-05-18
CN111171782A	2020-05-19
CN111363381A	2020-07-03
JP2012039064A	2012-02-23
JP2016014090A	2016-01-28
JP2018065921A	2018-04-26

HAYAKAWA Yuzi et al. (JP)

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