Title:
ADHESIVE FILM, ADEHSIVE FILM WITH SUPPORT SHEET, CURED BODY AND METHOD FOR PRODUCING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/097442
Kind Code:
A1
Abstract:
An adhesive film 1 which is formed of an adhesive resin composition that contains (A) a thermally conductive filler that is composed of at least one of a graphene having a two-dimensional structure and a single-walled boron nitride, (B) a thermosetting component and (C) a binder polymer, and which is used in a heating process that comprises a preliminary heating step and a complete curing step wherein the adhesive film 1 is completely cured after the preliminary heating step. In the preliminary heating step, the adhesive film 1 is held at a temperature that is not more than the temperature (T) descried below for 30 minutes or more. Temperature (T): a temperature at which the adhesive film 1 has a 0.5% weight loss if an adhesive film 1 before an arbitrary heating process is subjected to a thermogravimetric measurement wherein the adhesive film 1 is heated from 40°C to 400°C at a heating rate of 10°C/minute in the ambient atmosphere This adhesive film 1 exhibits excellent thermal conductivity.
Inventors:
ICHIKAWA ISAO (JP)
YOSHINOBU TAKEO (JP)
YOSHINOBU TAKEO (JP)
Application Number:
PCT/JP2021/038057
Publication Date:
May 12, 2022
Filing Date:
October 14, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/04; C09J7/35; C09J11/08; C09J163/00; C09J201/00; H01L23/373; H05K7/20
Domestic Patent References:
WO2020085316A1 | 2020-04-30 |
Foreign References:
KR20130086902A | 2013-08-05 | |||
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JP2018065921A | 2018-04-26 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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