Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION AND MANUFACTURING METHOD THEREOF, AND CIRCUIT CONNECTION STRUCTURE MANUFACTURING
Document Type and Number:
WIPO Patent Application WO/2022/059647
Kind Code:
A1
Abstract:
This circuit connection adhesive film 1 is provided with a first adhesive layer 2 and a second adhesive layer 3 laminated on the first adhesive layer 2, the first adhesive layer 2 contains the cured product of a light-and-heat curable composition, the second adhesive layer 3 contains a heat curable composition, and the light-and-heat curable composition contains a polymerizable compound, a photopolymerization initiator, a heat polymerization initiator, conductive particles 4 and a thiol compound.
Inventors:
ITOH AKIHIRO (JP)
OTO YUMIKO (JP)
KUDO SUNAO (JP)
OTO YUMIKO (JP)
KUDO SUNAO (JP)
Application Number:
PCT/JP2021/033553
Publication Date:
March 24, 2022
Filing Date:
September 13, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J4/00; C09J4/02; C09J7/30; C09J7/35; C09J9/02; C09J11/06; C09J201/00; H01R11/01; H01R43/00; H05K3/32; H05K3/36
Domestic Patent References:
| WO2019050005A1 | 2019-03-14 | |||
| WO2013154203A1 | 2013-10-17 | |||
| WO2020184583A1 | 2020-09-17 |
Foreign References:
| JP2008081713A | 2008-04-10 | |||
| JP2011070931A | 2011-04-07 | |||
| JP2014043574A | 2014-03-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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