Title:
THERMOSETTING COMPOSITION AND CURED PRODUCT AND FILM THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/059648
Kind Code:
A1
Abstract:
The present invention is a thermosetting composition containing a thermosetting compound represented by formula (1), a bisphenol epoxy compound, and an organic solvent, where 30≦A/B≦300 when A is the number-average molecular weight of the bisphenol epoxy compound and B (mass%) is the amount of bisphenol epoxy compound combined relative to the total amount of thermosetting compound and bisphenol epoxy compound combined. [In formula (1), M1 and M2 represent maleimide groups or maleimide-group-containing hydrocarbon groups; Ar1, Ar2, and Ar3 represent divalent aromatic hydrocarbon groups or divalent groups in which two or more aromatic hydrocarbons are bonded via a single bond, a divalent aliphatic hydrocarbon group, or a divalent alicyclic hydrocarbon group; and E represents an ester bond.]
Inventors:
TAGUCHI YOSHIAKI (JP)
FUKADA TAKUMI (JP)
FUKADA TAKUMI (JP)
Application Number:
PCT/JP2021/033555
Publication Date:
March 24, 2022
Filing Date:
September 13, 2021
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08G59/40
Domestic Patent References:
| WO2017169738A1 | 2017-10-05 |
Foreign References:
| JP2019194292A | 2019-11-07 | |||
| JP2019137713A | 2019-08-22 | |||
| JP2005263778A | 2005-09-29 | |||
| JPH04298527A | 1992-10-22 | |||
| JP2000191640A | 2000-07-11 | |||
| CN110655791A | 2020-01-07 |
Other References:
HYUN-GON MOON, MYUNG-SUP JUNG, JIN-HAE CHANG: "New liquid crystals and liquid crystalline thermosets based on wholly aromatic rigid-rod mesogens", MACROMOLECULAR RESEARCH, THE POLYMER SOCIETY OF KOREA, SEOUL, vol. 19, no. 1, 1 January 2011 (2011-01-01), Seoul, pages 2 - 7, XP055647220, ISSN: 1598-5032, DOI: 10.1007/s13233-011-0108-5
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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