Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/251386
Kind Code:
A1
Abstract:
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer that contains conductive particles, a cured product of a photocurable resin component, and a first heat-curable resin component; and a second adhesive layer that is provided on the first adhesive layer and contains a second heat-curable resin component. The first adhesive layer has a thickness of 5 μm or less.
Inventors:
NAKAZAWA TAKASHI (JP)
SAKAI HIROYUKI (JP)
FUKUI MASATO (JP)
NARITOMI KAZUYA (JP)
YAMAZAKI TOMOHARU (JP)
SAKAI HIROYUKI (JP)
FUKUI MASATO (JP)
NARITOMI KAZUYA (JP)
YAMAZAKI TOMOHARU (JP)
Application Number:
PCT/JP2021/021760
Publication Date:
December 16, 2021
Filing Date:
June 08, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B27/00; C08G59/24; C09J7/38; C09J9/02; C09J201/00; H05K1/14
Domestic Patent References:
| WO2019050006A1 | 2019-03-14 | |||
| WO2020022485A1 | 2020-01-30 |
Foreign References:
| JP2007246551A | 2007-09-27 | |||
| JPS62188184A | 1987-08-17 | |||
| CN101724361A | 2010-06-09 | |||
| JP2016054288A | 2016-04-14 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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