Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/106400
Kind Code:
A1
Abstract:
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection according to one embodiment comprises: a first adhesive layer containing electroconductive particles; and a second adhesive layer provided on the first adhesive layer. The flow ratio of the first adhesive layer with respect to the second adhesive layer, calculated by a prescribed procedure, is 0.30-0.80. The adhesive film for circuit connection according to another embodiment comprises: a first adhesive layer containing electroconductive particles, a cured product of a photocurable resin component, and a first heat-curable resin component; and a second adhesive layer that is provided on the first adhesive layer and contains a second heat-curable resin component. The photocurable resin component comprises a radically polymerizable compound and a photoradical polymerization initiator. The radically polymerizable compound comprises a polyfunctional (meth)acrylate.
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Inventors:
NARITOMI KAZUYA (JP)
ICHIMURA TAKAYUKI (JP)
NAKAZAWA TAKASHI (JP)
MORIYA TOSHIMITSU (JP)
ICHIMURA TAKAYUKI (JP)
NAKAZAWA TAKASHI (JP)
MORIYA TOSHIMITSU (JP)
Application Number:
PCT/JP2022/045456
Publication Date:
June 15, 2023
Filing Date:
December 09, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/30; C09J4/02; C09J9/02; C09J11/00; C09J201/00; H01L21/60; H05K1/14; H05K3/36
Domestic Patent References:
| WO2019050012A1 | 2019-03-14 | |||
| WO2022102672A1 | 2022-05-19 | |||
| WO2022102573A1 | 2022-05-19 |
Foreign References:
| JP2015149127A | 2015-08-20 | |||
| JP2017147224A | 2017-08-24 | |||
| JP2013110110A | 2013-06-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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