Title:
ADHESIVE FILM PRODUCTION APPARATUS AND REEL BODIES
Document Type and Number:
WIPO Patent Application WO/2021/161815
Kind Code:
A1
Abstract:
An adhesive film production apparatus 11 for producing an adhesive film 1 having an adhesive layer 3 on a base layer 2, wherein the adhesive film production apparatus 11 comprises a payout roller 12 that pays out a base material B of the adhesive film 1, a cutting part 13 that cuts the base material of the adhesive film 1 into a plurality of adhesive films 1 having prescribed widths, and a plurality of winding cores 14 that take up each of the plurality of adhesive films 1, and each of the plurality of winding cores 14 has a width that is greater than the width of the adhesive film being taken up.
Inventors:
TOMORI NAOKI (JP)
Application Number:
PCT/JP2021/003318
Publication Date:
August 19, 2021
Filing Date:
January 29, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B65H35/02; B65H18/10; B65H75/18; C09J7/30
Domestic Patent References:
| WO2014065262A1 | 2014-05-01 |
Foreign References:
| JP2002080167A | 2002-03-19 | |||
| JP2000136056A | 2000-05-16 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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