Title:
ADHESIVE FILM FOR USE IN SEMICONDUCTOR DEVICE MANUFACTURE, MANUFACTURING METHOD OF SAID ADHESIVE FILM, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/059188
Kind Code:
A1
Abstract:
This manufacturing method of an adhesive film for use in semiconductor device manufacture involves, in order, (A) a step in which a laminate is prepared which comprises at least a carrier film strip no more than 100 mm in width and an adhesive layer formed so as to cover the surface of the carrier film, and (B) a step in which, by die-cutting the adhesive layer, multiple adhesive pieces are obtained which are arranged on the carrier film aligned in the longitudinal direction of the carrier film, wherein, when performing the die-cutting in step (B), cuts are made into the adhesive layer and the carrier film so as to satisfy the condition represented by the inequality (1) below, and the adhesive pieces have a rectangular or square shape with a protrusion and/or recess formed on at least one side thereof.
(1) ... 0 < D/T ≤ 0.6
[D is the depth of the cut into the carrier film (unit μm), and T is the thickness of the carrier film (unit μm).]
Inventors:
OHKUBO KEISUKE (JP)
NATSUKAWA MASANORI (JP)
NATSUKAWA MASANORI (JP)
Application Number:
PCT/JP2018/034513
Publication Date:
March 28, 2019
Filing Date:
September 18, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/52; B32B7/12; B32B37/12; C09J7/22; H01L21/60; H01L21/683
Domestic Patent References:
| WO2014007116A1 | 2014-01-09 |
Foreign References:
| JP2002299389A | 2002-10-11 | |||
| JPH1131702A | 1999-02-02 | |||
| JP2006265411A | 2006-10-05 | |||
| JP2007009022A | 2007-01-18 | |||
| JP2014033177A | 2014-02-20 | |||
| JP2006111727A | 2006-04-27 | |||
| JP2010129632A | 2010-06-10 | |||
| JPH11274244A | 1999-10-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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