Title:
ADHESIVE FILM FOR USE IN SEMICONDUCTOR DEVICE MANUFACTURE, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/059189
Kind Code:
A1
Abstract:
This adhesive film is provided with a carrier film strip no more than 100 mm in width, and multiple adhesive pieces arranged on the carrier film aligned in the longitudinal direction of the carrier film, and the adhesive pieces have a rectangular or square shape with a protrusion and/or recess formed on at least one side thereof. This semiconductor device is provided with a semiconductor chip, a substrate to which the semiconductor chip is electrically connected, and an adhesive piece which is arranged between the semiconductor chip and the substrate and which bonds the semiconductor chip and the substrate together, and the shape of the semiconductor chip and the shape of the adhesive piece are different.
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Inventors:
OHKUBO KEISUKE (JP)
FUJIO SHUNSUKE (JP)
NATSUKAWA MASANORI (JP)
FUJIO SHUNSUKE (JP)
NATSUKAWA MASANORI (JP)
Application Number:
PCT/JP2018/034514
Publication Date:
March 28, 2019
Filing Date:
September 18, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/52; B32B7/02; B32B7/12; B32B37/12; C09J7/22; H01L21/60; H01L21/683
Domestic Patent References:
| WO2014007116A1 | 2014-01-09 |
Foreign References:
| JP2002299389A | 2002-10-11 | |||
| JPH1131702A | 1999-02-02 | |||
| JP2006265411A | 2006-10-05 | |||
| JP2007009022A | 2007-01-18 | |||
| JP2014033177A | 2014-02-20 | |||
| JP2010129632A | 2010-06-10 | |||
| JPH11274244A | 1999-10-08 | |||
| JP2006111727A | 2006-04-27 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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