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Patent Searching and Data


Title:
ADHESIVE LAMINATE
Document Type and Number:
WIPO Patent Application WO/2013/180305
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive laminate having excellent adhesiveness needed for adhesive attachment to a structure member. The present invention is an adhesive laminate for adhesive attachment to a structure member, the adhesive laminate containing: (A) a light-transmitting substrate layer (A-layer) composed of a melt-extruded thermoplastic resin; (B) a hard-coating layer (B-layer) formed using a hard coating agent in which colloidal silica and/or alkoxysilane hydrolysis condensate is 10 wt% or more in relation to the full hard coating weight, less a solvent; (C) an adhesive primer layer (C-layer); and GK228PCT-13-5-2; wherein (i) the A-layer through D-layer are layered in the stated order, (ii) the C-layer is formed of a primer composition comprising a silane coupling agent, 1 to 20 μm thick and having an elastic indentation modulus of 500 to 4000 MPa as measured by nanoindentation at a load of 800 μN or less, and (iii) the thickness (Y) of the D-layer is 0.9 to 14 mm.

Inventors:
KISHIMOTO HIROSHI (JP)
MORITA YUME (JP)
UZAWA YUKIKO (JP)
TAKAHASHI DAISUKE (JP)
Application Number:
PCT/JP2013/065517
Publication Date:
December 05, 2013
Filing Date:
May 29, 2013
Export Citation:
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Assignee:
TEIJIN LTD (JP)
International Classes:
B32B27/00; C09J7/29; C09J175/04
Foreign References:
JP2006255928A2006-09-28
JP2010179867A2010-08-19
JP2012057125A2012-03-22
JP2012183810A2012-09-27
JP2006255928A2006-09-28
JP2001064470A2001-03-13
JP2002129003A2002-05-09
JPH06172508A1994-06-21
JPH0827370A1996-01-30
JP2001055435A2001-02-27
JP2002117580A2002-04-19
Other References:
"Adhesives and Sealants: General Knowledge, Application Techniques, New Curing Techniques", 2006, ELSEVIER SCIENCE LTD., pages: 385
See also references of EP 2857469A4
Attorney, Agent or Firm:
OHSHIMA Masataka (JP)
Masataka Oshima (JP)
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