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Title:
ADHESIVE LAYER AND/OR BONDING AGENT LAYER
Document Type and Number:
WIPO Patent Application WO/2023/100864
Kind Code:
A1
Abstract:
The present invention provides an adhesive layer and/or a bonding agent layer, which exhibits excellent handling properties before adhesion or bonding to a member, while exhibiting excellent flexibility after adhesion or bonding to the member. The present invention provides an adhesive layer and/or a bonding agent layer, which is reduced in the stress by means of external stimuli. It is preferable that the stress does not increase once reduced. It is preferable that the ratio (S1(100)/S2(100)) of the stress (S1(100)) at 100% strain before application of external stimuli to the stress (S2(100)) at 100% strain after application of external stimuli is less than 0.95.

Inventors:
TOBINAGA SHUN (JP)
AMAMIYA KOTARO (JP)
MIZUNO DAISUKE (JP)
NAKANO TAKESHI (JP)
IWATA SATOSHI (JP)
Application Number:
PCT/JP2022/043961
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J5/00; C09J11/06; C09J201/00; C09J201/02
Domestic Patent References:
WO2017191827A12017-11-09
WO2022075366A12022-04-14
Foreign References:
CN109735280A2019-05-10
US20200332161A12020-10-22
JP2007131710A2007-05-31
Other References:
MIYAMOTO, YUKI; AMANO, YOSHIHIRO; SAITO, SHOICHI: "Development of Photo-Melt Resin", JOURNAL OF NETWORKPOLYMER, JP, vol. 42, no. 5, 10 September 2021 (2021-09-10), JP, pages 176 - 183, XP009546699, ISSN: 2433-3786, DOI: 10.11364/networkedpolymer.42.5_176
FURUTANI MASAHIRO, ARIMITSU, KOJI: "Dismantlable Adhesives Using Cleavable Chemical Bonds Such as Disulfide Bonds", JOURNAL OF THE ADHESION SOCIETY OF JAPAN, vol. 54, no. 8, 1 August 2018 (2018-08-01), pages 302 - 309, XP093069213
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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