Title:
PRESSURE-SENSITIVE ADHESIVE LAYER AND/OR ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2023/100863
Kind Code:
A1
Abstract:
Provided is a pressure-sensitive adhesive layer and/or an adhesive layer which, before application to members, has excellent handleability and which, after application to the members, has excellent flexibility. The pressure-sensitive adhesive layer and/or adhesive layer is reduced in hardness by an external stimulus. The hardness preferably does not increase after having been reduced. The ratio between the Young's modulus (E1) before application of the external stimulus and the Young's modulus (E2) after application of the external stimulus, E2/E1, is preferably less than 0.95. The Young's modulus (E2) after application of the external stimulus is preferably less than 50 MPa.
Inventors:
TOBINAGA SHUN (JP)
AMAMIYA KOTARO (JP)
MIZUNO DAISUKE (JP)
NAKANO TAKESHI (JP)
IWATA SATOSHI (JP)
AMAMIYA KOTARO (JP)
MIZUNO DAISUKE (JP)
NAKANO TAKESHI (JP)
IWATA SATOSHI (JP)
Application Number:
PCT/JP2022/043960
Publication Date:
June 08, 2023
Filing Date:
November 29, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J5/00; C09J201/00
Domestic Patent References:
| WO2017191827A1 | 2017-11-09 | |||
| WO2022075366A1 | 2022-04-14 |
Foreign References:
| CN109735280A | 2019-05-10 | |||
| US20200332161A1 | 2020-10-22 | |||
| JP2007131710A | 2007-05-31 |
Other References:
MIYAMOTO, YUKI; AMANO, YOSHIHIRO; SAITO, SHOICHI: "Development of Photo-Melt Resin", JOURNAL OF NETWORKPOLYMER, JP, vol. 42, no. 5, 10 September 2021 (2021-09-10), JP, pages 176 - 183, XP009546699, ISSN: 2433-3786, DOI: 10.11364/networkedpolymer.42.5_176
FURUTANI MASAHIRO, ARIMITSU, KOJI: "Dismantlable Adhesives Using Cleavable Chemical Bonds Such as Disulfide Bonds", JOURNAL OF THE ADHESION SOCIETY OF JAPAN, vol. 54, no. 8, 1 August 2018 (2018-08-01), pages 302 - 309, XP093069213
FURUTANI MASAHIRO, ARIMITSU, KOJI: "Dismantlable Adhesives Using Cleavable Chemical Bonds Such as Disulfide Bonds", JOURNAL OF THE ADHESION SOCIETY OF JAPAN, vol. 54, no. 8, 1 August 2018 (2018-08-01), pages 302 - 309, XP093069213
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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