Title:
ADHESIVE PAPER, ELECTROCHEMICAL DEVICE COMPRISING SAID ADHESIVE PAPER, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/039820
Kind Code:
A1
Abstract:
The present application provides an adhesive paper, an electrochemical device comprising said adhesive paper, and an electronic device. The adhesive paper comprises a bonding layer, an insulating heat-resistant layer, and an expansion layer located between the bonding layer and the insulating heat-resistant layer. The expansion layer comprises syndiotactic polystyrene. The adhesive paper has a good expansion rate and high temperature resistance. When the adhesive paper is applied to the electrochemical device, the expansion rate of the adhesive paper can reach 150% to 300%, and when the content of an electrolyte in the electrochemical device is reduced, the adhesive paper can still maintain the expansion rate and effectively fix an electrode assembly. Moreover, the adhesive paper is stable in shape and not prone to deformation at a high temperature, and a binding effect of the adhesive paper on the electrode assembly can be effectively maintained. Therefore, the electrochemical device of the present application has good high-temperature safety performance. The electronic device of the present application comprises the electrochemical device of the present application. Therefore, the electronic device has good high-temperature safety performance.
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Inventors:
HU KEWEN (CN)
Application Number:
PCT/CN2021/119013
Publication Date:
March 23, 2023
Filing Date:
September 17, 2021
Export Citation:
Assignee:
NINGDE AMPEREX TECHNOLOGY LTD (CN)
International Classes:
C09J7/24; H01M50/40
Foreign References:
| JPH10168410A | 1998-06-23 | |||
| CN109294463A | 2019-02-01 | |||
| CN111995957A | 2020-11-27 | |||
| CN107746682A | 2018-03-02 | |||
| JP2004284070A | 2004-10-14 |
Attorney, Agent or Firm:
PATENTSINO IP FIRM (CN)
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