TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT

Title:

TAPE FOR ELECTRONIC COMPONENT AND METHOD OF PROCESSING ELECTRONIC COMPONENT

Document Type and Number:

WIPO Patent Application WO/2020/209044

Kind Code:

A1

Abstract:

Provided are a tape for an electronic component and a method of processing an electronic component, which can sufficiently follow a semiconductor wafer having a bump with a large height and can prevent a dimple from occurring on the ground surface of the semiconductor wafer. The tape 1 for an electronic component according to the present invention is characterized in that the tape 1 has at least one resin layer 3, the resin layer 3 has a storage modulus of 10000 to 200000 Pa at any temperature of 60℃ to 80℃, and the melt flow rate is 10 g/10 min to 200 g/10 min.

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Inventors:

OKURA MASATO (JP)

Application Number:

PCT/JP2020/012848

Publication Date:

October 15, 2020

Filing Date:

March 24, 2020

Export Citation:

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Assignee:

FURUKAWA ELECTRIC CO LTD (JP)

International Classes:

C09J201/00; C09J7/24; C09J7/25; C09J7/35; H01L21/301; H01L21/304; H01L21/683

Foreign References:

JP2015004003A	2015-01-08
JP2013144722A	2013-07-25
JP2012216619A	2012-11-08
JP2019161031A	2019-09-19

Attorney, Agent or Firm:

MATSUSHITA, Makoto et al. (JP)

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