Title:
ADHESIVE RESIN COMPOSITION AND EASY-PEELING FILM
Document Type and Number:
WIPO Patent Application WO/2013/042727
Kind Code:
A1
Abstract:
An adhesive resin composition comprising: 29-84.9 wt% of an ethylene-vinyl acetate copolymer (A) which comprises 93-97 wt% of ethylene residue group units and 3-7 wt% of vinyl acetate residue group units and which has a melt mass flow rate of 8-30 g/10 min as measured by JIS K6924-1; 5-20 wt% of an ethylene-vinyl acetate copolymer (B) which comprises 80-90 wt% of ethylene residue group units and 10-20 wt% of vinyl acetate residue group units; 5-20 wt% of a low-density polyethylene (C); 5-20 wt% of a tackifier resin (D); and 0.1-1 wt% of an antistatic agent (E). This adhesive resin composition has properties offering excellent short-term heat seal performance and heat seal strength stability, and low heat seal duration dependence. An easy-peeling film having an adhesive layer comprising the adhesive resin composition will not create fluff during peeling on a container made of paper.
Inventors:
MORISHITA ISAO (JP)
Application Number:
PCT/JP2012/074064
Publication Date:
March 28, 2013
Filing Date:
September 20, 2012
Export Citation:
Assignee:
TOSOH CORP (JP)
International Classes:
C09J123/08; B65D65/40; B65D85/86; C09J7/02; C09J7/04; C09J11/00; C09K3/10
Foreign References:
| JP2009035645A | 2009-02-19 | |||
| JP2007519814A | 2007-07-19 | |||
| JP2005325222A | 2005-11-24 | |||
| JP2009035646A | 2009-02-19 | |||
| JPS5847038A | 1983-03-18 | |||
| JPS61183371A | 1986-08-16 | |||
| JP2002121338A | 2002-04-23 | |||
| JPS5815545A | 1983-01-28 | |||
| JP2012126784A | 2012-07-05 |
Attorney, Agent or Firm:
UCHIDA, YUKIO (JP)
Yukio Uchida (JP)
Yukio Uchida (JP)
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Claims: