Title:
ADHESIVE RESIN COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/022166
Kind Code:
A1
Abstract:
An adhesive resin composition comprising: 60-95 parts by mass of an ethylene-based polymer (A) including a modified ethylene-based polymer (a-2) obtained by modifying, by an unsaturated carboxylic acid and/or a derivative thereof, at least one polymer (a-1) selected from the group consisting of ethylene homopolymers and copolymers of ethylene and at least one α-olefin selected from α-olefins having 3-20 carbon atoms; and 5-40 parts by weight of a soft propylene-based copolymer (B) that has a structural unit derived from propylene and a structural unit that is derived from at least one α-olefin selected from α-olefins having 2 or 4-20 carbon atoms and that is contained in an amount of 40 mol% or less (the total amount of (A) and (B) being 100 parts by mass), wherein the adhesive resin composition has an MFR (190℃, 2.16 kg load) of 1-20 g/10min.
Inventors:
SHIGA RYOHEI (JP)
Application Number:
PCT/JP2022/031048
Publication Date:
February 23, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09J123/26; B32B27/00; B32B27/32; C08L23/14; C08L23/26; C09J7/35; C09J123/04; C09J123/14; H01M50/105; H01M50/121; H01M50/129
Domestic Patent References:
| WO2004087775A1 | 2004-10-14 |
Foreign References:
| JP2014157727A | 2014-08-28 | |||
| JP2007517940A | 2007-07-05 | |||
| JPH10259276A | 1998-09-29 | |||
| US20170198103A1 | 2017-07-13 | |||
| US20150325830A1 | 2015-11-12 | |||
| CN110041649A | 2019-07-23 | |||
| JP2007273398A | 2007-10-18 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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