Title:
ADHESIVE RESIN COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/022167
Kind Code:
A1
Abstract:
An adhesive resin composition including 60-95 mass parts of an ethylene polymer (A) that includes a modified ethylene polymer (a-2) obtained by modifying at least one polymer (a-1) selected from the group consisting of ethylene homopolymers and copolymers of ethylene and at least one α-olefin selected from C3-20 α-olefins by an unsaturated carboxylic acid and/or a derivative thereof and 5-40 mass parts of a butene polymer (B) having 80 mol% or more structural units derived from 1-butene (the total amount of (A) and (B) being 100 mass parts) and having an MFR (190°C, 2.16 kg load) of 1-20 g/10 min.
Inventors:
SHIGA RYOHEI (JP)
Application Number:
PCT/JP2022/031049
Publication Date:
February 23, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09J123/26; B32B27/00; B32B27/32; C08L23/20; C08L23/26; C09J7/35; C09J123/04; C09J123/18; H01M50/105; H01M50/121; H01M50/129
Foreign References:
| JP2014157727A | 2014-08-28 | |||
| JP2019099769A | 2019-06-24 | |||
| JP2020114889A | 2020-07-30 | |||
| JPH01301735A | 1989-12-05 | |||
| JPS6225139A | 1987-02-03 | |||
| CN112026317A | 2020-12-04 | |||
| JP2007273398A | 2007-10-18 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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