Title:
ADHESIVE RESIN COMPOSITION AND FILM
Document Type and Number:
WIPO Patent Application WO/2023/022168
Kind Code:
A1
Abstract:
An adhesive resin composition including: 50-89.9 parts by mass of a propylene polymer (A) that satisfies (a1) and (a2) below; 0.1-20 parts by mass of a modified polyolefin (B); and 10-30 parts by mass of an ethylene polymer (C) that satisfies (c1)-(c3) below (the total of (A)-(C) being 100 parts by mass). (a1) Includes a propylene polymer (a-1) that has a melting point greater than or equal to 120°C, and a propylene polymer (a-2) that has a melting point less than 120°C. (a2) The proportion of (A) that (a-1) accounts for is 50-70.0 mass%. (c1) Includes an ethylene homopolymer (c-1) and an ethylene/α-olefin copolymer (c-2). (c2) The MFR is 0.1-10 g/10 min. (c3) The proportion of (C) that (c-1) accounts for is 40-100 mass%.
Inventors:
YAMASAKI TAKASHI (JP)
OGAWA YOSHIYUKI (JP)
OGAWA YOSHIYUKI (JP)
Application Number:
PCT/JP2022/031050
Publication Date:
February 23, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B27/00; B32B15/00; B32B27/32; C08L23/08; C08L23/10; C08L23/26; C09J7/35; C09J123/08; C09J123/10; C09J123/26; H01M50/116; H01M50/126
Domestic Patent References:
| WO2019176403A1 | 2019-09-19 | |||
| WO2012077706A1 | 2012-06-14 | |||
| WO2018180165A1 | 2018-10-04 | |||
| WO2011078054A1 | 2011-06-30 |
Foreign References:
| JP2020111745A | 2020-07-27 | |||
| JP2020093428A | 2020-06-18 | |||
| JP2007273398A | 2007-10-18 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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