Title:
ADHESIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/1999/048990
Kind Code:
A1
Abstract:
An adhesive resin composition comprising an alicyclic polymer and a low-molecular weight compound having a molecular weight of 300 to 3,000; and a norbornene polymer having organic groups in the side chains, characterized in that the polymer has a weight-average molecular weight (M¿w?) as determined by gel permeation chromatography (GPC) in terms of polystyrene of 1,000 to 1,000,000 and that the organic groups in the side chains each has 3 to 30 carbon atoms and has a carboxyl group and at least one other polar group.
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Inventors:
KODEMURA JUNJI (JP)
SAKAMOTO MASATO (JP)
SAKAMOTO MASATO (JP)
Application Number:
PCT/JP1999/001490
Publication Date:
September 30, 1999
Filing Date:
March 24, 1999
Export Citation:
Assignee:
NIPPON ZEON CO (JP)
KODEMURA JUNJI (JP)
SAKAMOTO MASATO (JP)
KODEMURA JUNJI (JP)
SAKAMOTO MASATO (JP)
International Classes:
C08G61/08; C09J165/00; (IPC1-7): C09J145/00; C08F32/00; C08G61/08; C08L45/00; C08L101/00; C09D145/00; C09D201/00; C09J201/00
Foreign References:
JPS5240561A | 1977-03-29 | |||
JPS6254744A | 1987-03-10 | |||
JPS5076144A | 1975-06-21 | |||
JPH0395286A | 1991-04-19 | |||
JPS54149800A | 1979-11-24 | |||
JPS52101300A | 1977-08-25 | |||
JPH05214079A | 1993-08-24 | |||
JPS5131800A | 1976-03-18 |
Attorney, Agent or Firm:
Nishikawa, Shigeaki (Higashi-Nippori 3-chome Arakawa-ku Tokyo, JP)
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