Title:
ADHESIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/047971
Kind Code:
A1
Abstract:
This adhesive resin composition is characterized by containing a polyester resin (A) and satisfying the requirements: (i) the adhesive resin composition contains substantially no hardener and (ii) the adhesive resin composition, after having been heated at 200°C for 1 hour, has a tetrahydrofuran-insoluble content of 10 mass% or higher. This adhesive resin composition has satisfactory pot life properties and is excellent in terms of soldering heat resistance, adhesiveness to various substates, and other properties, although containing substantially no hardener. Also provided are: a laminate or adhesive sheet which includes an adhesive layer obtained from this adhesive resin composition; a printed wiring board or packaging material which includes the laminate as a constituent element; and a layered film for decorating three-dimensional molded articles or a film for metal-can laminating which includes the adhesive sheet as a constituent element.
Inventors:
MIEDA HIROYUKI (JP)
SAKAMOTO KOICHI (JP)
MIKAMI TADAHIKO (JP)
SAKAMOTO KOICHI (JP)
MIKAMI TADAHIKO (JP)
Application Number:
PCT/JP2022/033786
Publication Date:
March 30, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B65D8/16; B65D65/02; C08G63/12; C09J7/30; C09J167/00; C09J167/02; H05K1/03
Foreign References:
| JP2006206860A | 2006-08-10 | |||
| JP2013075965A | 2013-04-25 | |||
| JP2009084348A | 2009-04-23 | |||
| JP2004250484A | 2004-09-09 | |||
| JP2011074188A | 2011-04-14 | |||
| JP2008205370A | 2008-09-04 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
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