Title:
ADHESIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/047972
Kind Code:
A1
Abstract:
This adhesive resin composition contains a polyester resin (A) and is characterized by satisfying the following requirements: (i) the acid value of the polyester resin (A) is 100 eq/ton or more; (ii) the adhesive resin composition contains substantially no curing agents; and (iii) the adhesive resin composition includes, as polyol components constituting the polyester resin (A), a diol (a) having two primary hydroxyl groups and not having an alicyclic structure, and one or both of a diol (b) having an alicyclic structure and a diol (c) that has one primary hydroxyl group and one secondary hydroxyl group and does not have an alicyclic structure. The adhesive resin composition has suitable pot life properties despite containing substantially no curing agents and has excellent characteristics including solder heat resistance and adhesion to various substrates. The present invention also provides: a laminate or an adhesive sheet having an adhesive layer comprising the adhesive resin composition; a printed wiring board or a packaging material including the laminate as a component thereof; and a laminate film for decorating a three-dimensional molded article or a film for laminating metal cans including the adhesive sheet as a component.
Inventors:
MIEDA HIROYUKI (JP)
SAKAMOTO KOICHI (JP)
MIKAMI TADAHIKO (JP)
SAKAMOTO KOICHI (JP)
MIKAMI TADAHIKO (JP)
Application Number:
PCT/JP2022/033787
Publication Date:
March 30, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B65D8/16; B65D65/02; C08G63/12; C09J7/30; C09J167/00; C09J167/02; H05K1/03
Foreign References:
| JP2006206860A | 2006-08-10 | |||
| JP2013075965A | 2013-04-25 | |||
| JP2009084348A | 2009-04-23 | |||
| JP2004250484A | 2004-09-09 | |||
| JP2011074188A | 2011-04-14 | |||
| JP2008205370A | 2008-09-04 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
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