Title:
ADHESIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/047973
Kind Code:
A1
Abstract:
This adhesive resin composition includes a polyester resin (A), and is characterized by satisfying the following requirements: (i) the polyester resin (A) has an acid value of 100 eq/ton or greater; (ii) a polyol component used for constituting the polyester resin (A) comprised a diol (a) having two primary hydroxyl groups but having no alicyclic structure and further included a diol (b) having an alicyclic structure and/or a diol (c) having one primary hydroxyl group and one secondary hydroxyl group but having no alicyclic structure; and (iii) a polycarboxylic acid component used for constituting the polyester resin (A) comprised an unsaturated dicarboxylic acid (d). This adhesive resin composition can cure even when containing substantially no hardener and is excellent in terms of properties including soldering heat resistance and adhesiveness to various substrates. The present invention further provides a laminate or adhesive sheet including an adhesive layer formed from this adhesive resin composition, a printed wiring board or packaging material including the laminate as a constituent element, and a layered film for decorating three-dimensional shaped articles or film for metal-can laminating which includes the adhesive sheet as a constituent element.
Inventors:
MIEDA HIROYUKI (JP)
SAKAMOTO KOICHI (JP)
MIKAMI TADAHIKO (JP)
SAKAMOTO KOICHI (JP)
MIKAMI TADAHIKO (JP)
Application Number:
PCT/JP2022/033788
Publication Date:
March 30, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B65D8/16; B65D65/02; C08G63/12; C09J7/30; C09J167/02; H05K1/03
Foreign References:
| JP2006206860A | 2006-08-10 | |||
| JP2013075965A | 2013-04-25 | |||
| JP2009084348A | 2009-04-23 | |||
| JP2004250484A | 2004-09-09 | |||
| JP2011074188A | 2011-04-14 | |||
| JP2008205370A | 2008-09-04 |
Attorney, Agent or Firm:
KAZAHAYA, Nobuaki et al. (JP)
Download PDF: