ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME

WIPO Patent Application WO/2010/098155

A1

Provided are adhesive compositions that are halogen-free and have satisfactory flame resistance without loss of adhesiveness or solder heat resistance, and laminates and flexible printed wiring boards using same. The adhesive resin compositions comprise an epoxy resin, a thermoplastic resin, a benzoxadine compound, a halogen-free flame retardant, and a curing agent. At least one or the other of the epoxy resin or the thermoplastic resin comprises a phosphorus-containing resin. The phosphorus content in the solid portion of said adhesive resin composition is 2.5 mass% or more. It is preferable that a phosphorus-containing epoxy resin is used for said epoxy resin and a thermoplastic resin comprising 10-70 mass% of a phosphorus-containing polyester is used for said thermoplastic resin, and that the amount of benzoxadine per 100 parts of resin is 5‑25 parts by mass and the amount of halogen-free flame retardant is 1‑30 parts by weight.

KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
MIZOGUCHI AKIRA (JP)
ASAI SYOUGO (JP)
YOSHISAKA TAKUMA (JP)
UENISHI NAOTA (JP)

PCT/JP2010/050482

September 02, 2010

January 18, 2010

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SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC PRINTED CIRCUITS (JP)
KAIMORI SHINGO (JP)
SUGAWARA JUN (JP)
MIZOGUCHI AKIRA (JP)
ASAI SYOUGO (JP)
YOSHISAKA TAKUMA (JP)
UENISHI NAOTA (JP)

C09J163/00; B32B15/08; B32B27/38; C09J7/35; C09J11/00; C09J11/06; C09J167/00; C09J177/00; C09J201/02; H05K1/03

JP2005053989A	2005-03-03
JP2008231287A	2008-10-02
JP2008231195A	2008-10-02
JP2006045322A	2006-02-16
JP2003176470A	2003-06-24

NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)

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