ADHESIVE RESIN MIXTURE AND SELF-ASSEMBLING ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONTROLLED FLUIDITY

Title:

ADHESIVE RESIN MIXTURE AND SELF-ASSEMBLING ANISOTROPIC CONDUCTIVE ADHESIVE HAVING CONTROLLED FLUIDITY

Document Type and Number:

WIPO Patent Application WO/2023/128631

Kind Code:

A1

Abstract:

An embodiment of the present invention provides an adhesive resin mixture having controlled fluidity, and a self-assembling anisotropic conductive adhesive comprising the adhesive resin mixture. The self-assembling anisotropic conductive adhesive comprising the adhesive resin mixture having controlled fluidity provides excellent contact resistance while also providing superior adhesion compared to that provided by conventional adhesives.

Inventors:

PARK EUN HYE (KR)
JEONG SO UN (KR)
LEE KYUNG SUB (KR)

Application Number:

PCT/KR2022/021555

Publication Date:

July 06, 2023

Filing Date:

December 28, 2022

Export Citation:

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Assignee:

NOPION CO LTD (KR)

International Classes:

C09J9/02; C09J11/04; C09J163/00; H05K3/32; H05K3/34

Foreign References:

KR20170011633A	2017-02-02
KR19980066134A	1998-10-15
KR20150125882A	2015-11-10
JP2013060479A	2013-04-04
JP2020152789A	2020-09-24

Attorney, Agent or Firm:

HAN, Sang Soo (KR)

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