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Title:
ANISOTROPIC CONDUCTIVE ADHESIVE FOR FLEXIBLE CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2023/128632
Kind Code:
A1
Abstract:
An embodiment of the present invention provides: an adhesive resin composition comprising substituted or unsubstituted dicyclopentadiene and a substituted or unsubstituted acrylic compound and having a storage modulus of 100 Pa to 1000 Pa at 100°C to 300°C; and self-assembling anisotropic conductive adhesive comprising the adhesive resin composition, leading to an effect of having excellent adhesion even in a flexible display or a semiconductor device.

Inventors:
PARK EUN HYE (KR)
JEONG SO UN (KR)
LEE KYUNG SUB (KR)
Application Number:
PCT/KR2022/021556
Publication Date:
July 06, 2023
Filing Date:
December 28, 2022
Export Citation:
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Assignee:
NOPION CO LTD (KR)
International Classes:
C09J9/02; C09J4/00; C09J11/04; H05K3/32; H05K3/34
Foreign References:
KR101777964B12017-09-13
KR20100037124A2010-04-08
KR20090115516A2009-11-05
JP2016145287A2016-08-12
KR20190046352A2019-05-07
Attorney, Agent or Firm:
HAN, Sang Soo (KR)
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