Title:
ADHESIVE SHEET, ADHESIVE COMPOSITION, ADHESIVE SHEET WITH RELEASE FILM, LAMINATE FOR IMAGE DISPLAY DEVICE, AND FLEXIBLE IMAGE DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/038147
Kind Code:
A1
Abstract:
Provided is an adhesive sheet that achieves, at a high level, both conformance to three-dimensional geometry during bonding and shape-retention ability during non-bonding and that has excellent flexibility particularly in a low-temperature environment. The adhesive sheet comprises an adhesive layer that is formed from an adhesive composition containing a (meth)acrylic copolymer, wherein: (1) distortion (creep strain) is 1000-100000% when the thickness is 0.7-1.0 mm and a pressure of 2 kPa is applied for 600 seconds at a temperature of 60°C; (2) in a measurement of retention ability according to JIS-Z-0237 (ISO29863), falling time is 60 seconds or more when the sheet having an area of 20 mm × 20 mm is adhered to an SUS plate and a load of 500 gf is applied in an atmosphere of 40°C; and (3) storage shear modulus at -20°C (G' (-20°C)), obtained by dynamic viscoelastic measurement in a shear mode at 1 Hz frequency, is 10-1000 kPa when the thickness is 0.7-1.0 mm.
Inventors:
HIROSE KOHEI (JP)
MATSUSHITA AKIFUMI (JP)
TANIGUCHI KOUTA (JP)
MASUDA ERI (JP)
KANAZAWA NOBUAKI (JP)
MATSUSHITA AKIFUMI (JP)
TANIGUCHI KOUTA (JP)
MASUDA ERI (JP)
KANAZAWA NOBUAKI (JP)
Application Number:
PCT/JP2022/034163
Publication Date:
March 16, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08F220/16; C09J7/38; C09J133/00; C09J133/04; C09J133/06; C09J133/14; H10K50/00
Domestic Patent References:
WO2020032287A1 | 2020-02-13 | |||
WO2006007999A2 | 2006-01-26 | |||
WO2020139673A1 | 2020-07-02 |
Foreign References:
JP2011219582A | 2011-11-04 | |||
JP2017119795A | 2017-07-06 | |||
JP2017119801A | 2017-07-06 | |||
JP2017095660A | 2017-06-01 | |||
JP2018039999A | 2018-03-15 | |||
JP2011500895A | 2011-01-06 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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