Title:
ELECTROCONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/038146
Kind Code:
A1
Abstract:
Provided is an electroconductive resin composition that can cure at a temperature of 150°C or less and has exceptional electroconductivity, adhesive strength, and solvent resistance after curing. An electroconductive resin composition containing at least 0.3-5 parts by mass of (B) a cationic initiator and 250-2,400 parts by mass of (C) electroconductive particles per 100 parts by mass of a cationically polymerizable compound (A) including (A-1) an alicyclic epoxy compound and (A-2) a rubber-modified epoxy resin, the content ratio of the alicyclic epoxy compound (A-1) being 20 mass% or greater in component (A) and the content ratio of the rubber-modified epoxy resin (A-2) being 0.4-15 mass% in component (A).
Inventors:
AMAMOTO SYUHEI (JP)
NAGAI TAKUMI (JP)
NAGAI TAKUMI (JP)
Application Number:
PCT/JP2022/034155
Publication Date:
March 16, 2023
Filing Date:
September 13, 2022
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J9/02; C09J11/04; C09J11/06; C09J163/00; H01B1/22
Domestic Patent References:
| WO2019159566A1 | 2019-08-22 |
Foreign References:
| JP2004155957A | 2004-06-03 | |||
| JP2019130568A | 2019-08-08 | |||
| JPH1160899A | 1999-03-05 | |||
| JPH11116778A | 1999-04-27 | |||
| JP2013229277A | 2013-11-07 |
Attorney, Agent or Firm:
TSUTADA & CO. (JP)
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