Title:
ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/022076
Kind Code:
A1
Abstract:
The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the adhesive sheet 1A includes a preparation step for preparing a backed laminate 8 that comprises a laminate 6 that includes a release film 2 and an adhesive film layer 5 that is provided on the release film 2 and a backing material 7 that is stuck to the release film 2 side of the laminate 6, a laminate cutting step for cutting a cut c1 into the laminate 6 along an arbitrary cutout shape, and a backing material peeling step for peeling the backing material 7 from the laminate 6. During the backing material peeling step, the portion 6A of the laminate 6 that is in the region surrounded by the cut c1 remains stuck to the backing material 7 and is removed.
Inventors:
KIKUCHI KENTA (JP)
IZAWA HIROYUKI (JP)
TATSUZAWA TAKASHI (JP)
SATO MAYUMI (JP)
MAEHARA YASUO (JP)
TAKAIRA HIROSHI (JP)
FUKUI TAKAHIRO (JP)
TOMISAKA KATSUHIKO (JP)
MATSUZAKI TOSHIAKI (JP)
IZAWA HIROYUKI (JP)
TATSUZAWA TAKASHI (JP)
SATO MAYUMI (JP)
MAEHARA YASUO (JP)
TAKAIRA HIROSHI (JP)
FUKUI TAKAHIRO (JP)
TOMISAKA KATSUHIKO (JP)
MATSUZAKI TOSHIAKI (JP)
Application Number:
PCT/JP2022/030473
Publication Date:
February 23, 2023
Filing Date:
August 09, 2022
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J7/30; C09J9/02; C09J201/00; H01R43/00; H05K3/32
Domestic Patent References:
| WO2018066411A1 | 2018-04-12 |
Foreign References:
| JPH093409A | 1997-01-07 | |||
| JP2016027136A | 2016-02-18 | |||
| JP2012169441A | 2012-09-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: