Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/022075
Kind Code:
A1
Abstract:
This high-frequency module (1A) comprises a module board (91) having principal surfaces (91a and 91b) that are reverse to each other and a power amplifier (11), the power amplifier (11) including amplification elements (11A and 11B), an output transformer (31) that has a primary coil (31a) and a secondary coil (31b), and a capacitor (81) that is connected to the output transformer (31). One end of the primary coil (31a) is connected to the amplification element (11A) and the other end of the primary coil (31a) is connected to the amplification element (11B), and one end of the secondary coil (31b) is connected to an output terminal (116). The output transformer (31) is arranged on the module board (91) at a position closer to one of the principal surfaces (91a and 91b), and the capacitor (81) is arranged on the other of the principal surfaces (91a and 91b) so as to overlap the output transformer (31) when the module board (91) is seen in plan view.
Inventors:
SHOUNAI HIROKI (JP)
YAMAGUCHI YUKIYA (JP)
HORITA ATSUSHI (JP)
YAMAGUCHI YUKIYA (JP)
HORITA ATSUSHI (JP)
Application Number:
PCT/JP2022/030450
Publication Date:
February 23, 2023
Filing Date:
August 09, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/03; H03F1/02; H03F3/195; H03F3/24; H03F3/45; H03F3/68; H04B1/38
Domestic Patent References:
| WO2021084848A1 | 2021-05-06 |
Foreign References:
| JP2021061577A | 2021-04-15 | |||
| JP2002359327A | 2002-12-13 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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