Title:
ADHESIVE SHEET FOR PROVISIONAL FIXATION OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/243487
Kind Code:
A1
Abstract:
The present invention provides an adhesive sheet for provisional fixation of an electronic component, the adhesive sheet being releasable by means of light irradiation; and this adhesive sheet for provisional fixation of an electronic component has a wide range of choices of light for irradiation. An adhesive sheet for provisional fixation of an electronic component according to the present invention comprises a multilayer structure A that comprises a first photothermal conversion layer and a second photothermal conversion layer that is arranged on at least one side of the first photothermal conversion layer, and an adhesive layer that is arranged on at least one side of the multilayer structure A; the transmittance of light having a wavelength of 1,032 nm is 75% or less; and the transmittance of light having a wavelength of 355 nm is 50% or less.
Inventors:
UENO SHUSAKU (JP)
KATO KAZUMICHI (JP)
KATAOKA NAOKI (JP)
KATO KAZUMICHI (JP)
KATAOKA NAOKI (JP)
Application Number:
PCT/JP2023/020975
Publication Date:
December 21, 2023
Filing Date:
June 06, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/301; B32B7/06; B32B27/00; H01L21/304
Domestic Patent References:
| WO2017033639A1 | 2017-03-02 | |||
| WO2015146312A1 | 2015-10-01 | |||
| WO2019131856A1 | 2019-07-04 |
Foreign References:
| JP2015223823A | 2015-12-14 | |||
| JP4565804B2 | 2010-10-20 | |||
| JP2016500918A | 2016-01-14 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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