Title:
ADHESIVE SHEET FOR PROVISIONAL FIXATION OF ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/243488
Kind Code:
A1
Abstract:
The present invention provides an adhesive sheet for provisional fixation of an electronic component, the adhesive sheet having a photothermal conversion function, while exhibiting excellent heat resistance. An adhesive sheet for provisional fixation of an electronic component according to one embodiment of the present invention comprises a photothermal conversion layer; the light transmittance of this adhesive sheet for provisional fixation of an electronic component at the wavelength of 1,032 nm is 60% or less; the light transmittance of this adhesive sheet for provisional fixation of an electronic component at the wavelength of 355 nm is 60% or less; the photothermal conversion layer contains carbon black; and the 5% weight loss temperature of the photothermal conversion layer after irradiation of ultraviolet light is 300°C or more.
Inventors:
UENO SHUSAKU (JP)
KATAOKA NAOKI (JP)
SHISHIDO YUICHIRO (JP)
KATAOKA NAOKI (JP)
SHISHIDO YUICHIRO (JP)
Application Number:
PCT/JP2023/020977
Publication Date:
December 21, 2023
Filing Date:
June 06, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/301; B32B7/023; B32B7/027; B32B7/06; B32B27/00; C09J7/29; C09J7/38; H01L21/304; H01L21/50
Domestic Patent References:
| WO2020137980A1 | 2020-07-02 | |||
| WO2021131518A1 | 2021-07-01 | |||
| WO2017033639A1 | 2017-03-02 | |||
| WO2019131856A1 | 2019-07-04 |
Foreign References:
| JP4565804B2 | 2010-10-20 | |||
| JP2015224316A | 2015-12-14 | |||
| JP2015513211A | 2015-04-30 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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