Title:
ADHESIVE SHEET FOR SEMICONDUCTOR PROCESSING AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/190728
Kind Code:
A1
Abstract:
The present invention relates to an adhesive sheet for semiconductor processing having a base material, a middle layer (X) having energy ray curability, and an adhesive agent layer (Y) in that order, that satisfies requirement (1). Requirement (1): using the storage modulus G'(x) (unit: MPa) of the middle layer (X) at 23°C when irradiated by ultraviolet rays at an illuminance of 230 mW/cm2 and a radiation intensity of 380 mJ/cm2 and the storage modulus G'(y) (unit: MPa) of the adhesive agent layer (Y) at 23°C, the Q value (unit: MPa) calculated by formula (1) is -30 to 30, inclusive. Q = {G'(y)-(G'(x) × 40)} … formula (1). The present invention also relates to a method for producing a semiconductor device using the adhesive sheet for semiconductor processing.
Inventors:
SAKAJIRI KOSUKE (JP)
OGASAWARA TAKAFUMI (JP)
TAMURA KAZUYUKI (JP)
OGASAWARA TAKAFUMI (JP)
TAMURA KAZUYUKI (JP)
Application Number:
PCT/JP2022/004346
Publication Date:
September 15, 2022
Filing Date:
February 04, 2022
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/38; C09J7/20; C09J7/29; C09J133/04; H01L21/301; H01L21/304
Domestic Patent References:
| WO2016121488A1 | 2016-08-04 | |||
| WO2018092446A1 | 2018-05-24 |
Foreign References:
| JP2012207194A | 2012-10-25 | |||
| JP2018168291A | 2018-11-01 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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