Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2014/142192
Kind Code:
A1
Abstract:
Provided is an adhesive sheet which is able to realize excellent cutting precision and a reduction in cutting debris when cutting microcomponents such as electronic components. This adhesive sheet is provided with an adhesive layer which includes a plurality of thermally expandable microspheres and an anchoring layer which is disposed on one side of the adhesive layer, with at least one or more thermally expandable microspheres protruding from the adhesive layer and the protruding thermally expandable microspheres being embedded in the anchoring layer. In a preferred embodiment, the adhesive layer includes thermally expandable microspheres having a larger particle diameter than the thickness of the adhesive layer.
Inventors:
HIRAYAMA TAKAMASA (JP)
KITAYAMA KAZUHIRO (JP)
KITAYAMA KAZUHIRO (JP)
Application Number:
PCT/JP2014/056548
Publication Date:
September 18, 2014
Filing Date:
March 12, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/29; C09J11/02; C09J201/00
Domestic Patent References:
| WO2012118152A1 | 2012-09-07 | |||
| WO2008053713A1 | 2008-05-08 |
Attorney, Agent or Firm:
MOMII, Takafumi (JP)
Takafumi Momii (JP)
Takafumi Momii (JP)
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