Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/038917
Kind Code:
A1
Abstract:
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising: a substrate (11); an adhesive agent layer (12) including an adhesive agent; and an oligomer sealing layer (13) provided between the substrate (11) and the adhesive agent layer (12).
Inventors:
TAKANO KEN (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
Application Number:
PCT/JP2016/075604
Publication Date:
March 09, 2017
Filing Date:
September 01, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B27/38; C09J7/20; C09J133/08; C09J183/04; H01L21/56
Foreign References:
| JP2008045091A | 2008-02-28 | |||
| JP2013038098A | 2013-02-21 | |||
| JP2014239151A | 2014-12-18 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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