Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/181510
Kind Code:
A1
Abstract:
The present invention pertains to an adhesive sheet 1 delamination method for delaminating the adhesive sheet 1 provided with at least an adhesive layer 2 and delaminating attaching bodies W, W' attached to the adhesive surface P of the adhesive layer 2, wherein the method is characterized in that: the adhesive layer 2 has a recess part 3 in the adhesive surface P; the attaching bodies W, W' are attached to the adhesive sheet 1 so that an independent space C is formed by the recess part 3 of the adhesive layer 2; a depressurizing process for expanding a gas inside the space C is performed on the adhesive sheet 1, to which at least the attaching bodies W, W' are attached, to thereby reduce the adhesion of the adhesive layer 2 and delaminate the adhesive sheet 1 and the attaching bodies W, W'. Through this method, the adhesion can be reduced at a desired timing by means of a novel acting mechanism.
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Inventors:
UEMURA KAZUE (JP)
Application Number:
PCT/JP2018/012837
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J5/00; C09J7/38; C09J133/04; H01L21/683
Foreign References:
| JP2009035660A | 2009-02-19 | |||
| JP2010129701A | 2010-06-10 | |||
| JP2012136678A | 2012-07-19 | |||
| JP2002121505A | 2002-04-26 | |||
| JP2012193317A | 2012-10-11 |
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
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