Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD FOR DELAMINATING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/181511
Kind Code:
A1
Abstract:
The present invention pertains to an adhesive sheet 1 delamination method for delaminating the adhesive sheet 1 provided with at least an adhesive layer 2 and delaminating attaching bodies W, W' attached to the adhesive surface P of the adhesive layer 2, wherein the method is characterized in that: the adhesive layer 2 has an air chamber 3 therein; and a depressurizing process for expanding a gas inside the air chamber 3 is performed on the adhesive sheet 1, to which at least the attaching bodies W, W' are attached, to thereby reduce the adhesion of the adhesive layer 2 and delaminate the adhesive sheet 1 and the attaching bodies W, W'. Through this method, the adhesion can be reduced at a desired timing by means of a novel acting mechanism.

Inventors:
UEMURA KAZUE (JP)
Application Number:
PCT/JP2018/012838
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
C09J5/00; C09J7/38; C09J133/04; H01L21/683
Foreign References:
JP2009035660A2009-02-19
JP2010129701A2010-06-10
JP2012136678A2012-07-19
JP2002088320A2002-03-27
JP2013060489A2013-04-04
Attorney, Agent or Firm:
HAYAKAWA Yuzi et al. (JP)
Download PDF: