Title:
ADHESIVE TAPE AFFIXING METHOD AND ADHESIVE TAPE AFFIXING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/065005
Kind Code:
A1
Abstract:
The outer periphery of a wafer W is heated via a ring-shaped holding part 51 of a holding table 5 that holds the outer periphery of the wafer W. From the center of the holding table 5 toward the outer periphery, a heated gas is supplied between the wafer W and a ring-shaped protruding part 52, which closely faces the wafer W between the holding part 51 and the center of the holding table 5. As the entire wafer surface is uniformly heated and pressurized, an adhesive tape is pressed by an affixing roller and affixed to the wafer W.
Inventors:
MURAYAMA AKIHIRO (JP)
Application Number:
PCT/JP2016/078490
Publication Date:
April 20, 2017
Filing Date:
September 27, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/683
Foreign References:
| JPH0254564A | 1990-02-23 | |||
| JPH03204955A | 1991-09-06 | |||
| JP2001118811A | 2001-04-27 | |||
| JPH04241441A | 1992-08-28 | |||
| JPH07201956A | 1995-08-04 | |||
| JP2012084563A | 2012-04-26 | |||
| JP2011199157A | 2011-10-06 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
Download PDF:
Previous Patent: IMAGE PICKUP DEVICE
Next Patent: ADHESIVE TAPE AFFIXING METHOD AND ADHESIVE TAPE AFFIXING DEVICE
Next Patent: ADHESIVE TAPE AFFIXING METHOD AND ADHESIVE TAPE AFFIXING DEVICE