Title:
ADHESIVE TAPE AFFIXING METHOD AND ADHESIVE TAPE AFFIXING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/065006
Kind Code:
A1
Abstract:
The outer periphery of a wafer W is heated via a ring-shaped holding part 51 provided to a ring-shaped chuck table 5A that constitutes a holding table 5. A heating member 5B that moves upward and downward on the inner side of the chuck table 5A is positioned so as to closely face the unheld surface of the wafer W held by the holding part 51, and a heated gas is supplied between the wafer W and the heating member 5B from the center toward the outer periphery such that the wafer is heated and pressurized. In this state, an adhesive tape T is affixed across a ring frame f and the wafer W while the adhesive tape T is pressed by an affixing roller 109.
Inventors:
MURAYAMA AKIHIRO (JP)
Application Number:
PCT/JP2016/078491
Publication Date:
April 20, 2017
Filing Date:
September 27, 2016
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/683
Foreign References:
| JPH0254564A | 1990-02-23 | |||
| JP2001118811A | 2001-04-27 | |||
| JPH04241441A | 1992-08-28 | |||
| JPH03204955A | 1991-09-06 | |||
| JPH07201956A | 1995-08-04 | |||
| JP2012084563A | 2012-04-26 | |||
| JP2011199157A | 2011-10-06 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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