Title:
ADHESIVE TAPE AND METHOD FOR MANUFACTURING ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/054483
Kind Code:
A1
Abstract:
The present invention provides: an adhesive tape in which anchoring fractures are suppressed; and a method for manufacturing the same. An adhesive tape according to an embodiment of the present invention includes, in the following order: a base material containing an olefin resin; a first adhesive agent layer containing an olefin resin; and a second adhesive agent layer containing a styrene elastomer. A method for manufacturing an adhesive tape according to an embodiment of the present invention is a method for manufacturing an adhesive tape which includes, in the following order: a base material containing an olefin resin; a first adhesive agent layer containing an olefin resin; and a second adhesive agent layer containing a styrene elastomer. Said method includes: hot-melt application, to the base material, of an adhesive agent composition which forms the first adhesive agent layer; and hot-melt application, to the first adhesive agent layer, of an adhesive agent composition which forms the second adhesive agent layer.
Inventors:
UCHIDA SHO (JP)
TAKEDA KOHEI (JP)
UCHIDA KENTARO (JP)
IKISHIMA SHINSUKE (JP)
TAKEDA KOHEI (JP)
UCHIDA KENTARO (JP)
IKISHIMA SHINSUKE (JP)
Application Number:
PCT/JP2022/036202
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; B05D1/34; B05D1/36; B05D3/02; B05D7/04; B05D7/24; C09J7/24; C09J11/08; C09J123/10; C09J153/02
Foreign References:
| JP2012144668A | 2012-08-02 | |||
| JP2016023252A | 2016-02-08 | |||
| JP2011213753A | 2011-10-27 | |||
| JP2001139898A | 2001-05-22 | |||
| JP2003096415A | 2003-04-03 | |||
| JP2009108185A | 2009-05-21 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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