Title:
HOT MELT ADHESIVE COMPOSITION AND ADHESIVE TAPE USING SAID HOT MELT ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/054482
Kind Code:
A1
Abstract:
The present invention provides: an adhesive composition which has sufficient initial adhesive force and is capable of achieving a good balance between resealability and easy openability; and an adhesive tape which uses this adhesive composition. A hot melt adhesive composition according to one embodiment of the present invention contains a styrene elastomer, an olefin elastomer and a tackifying agent. This hot melt adhesive composition contains 2% by weight to 80% by weight of the styrene elastomer, 2% by weight to 50% by weight of the olefin elastomer, and 2% by weight to 40% by weight of the tackifying agent.
Inventors:
UCHIDA SHO (JP)
TAKEDA KOHEI (JP)
IKISHIMA SHINSUKE (JP)
TAKEDA KOHEI (JP)
IKISHIMA SHINSUKE (JP)
Application Number:
PCT/JP2022/036201
Publication Date:
April 06, 2023
Filing Date:
September 28, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J11/06; C09J7/38; C09J11/08; C09J109/06; C09J123/00; C09J123/04; C09J123/10; C09J123/20; C09J125/04; C09J125/10; C09J153/02
Foreign References:
| JP2020534217A | 2020-11-26 | |||
| JP2013072081A | 2013-04-22 | |||
| JP2021088614A | 2021-06-10 | |||
| JP2019522684A | 2019-08-15 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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