Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE TAPE AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/097472
Kind Code:
A1
Abstract:
Provided is an adhesive tape which comprises a base material layer and an adhesive layer that is provided on the base material layer, wherein the adhesive layer contains a photo-radical initiator and a polymer A that has a polymerizable carbon double bond, the tensile elastic modulus of the adhesive layer after ultraviolet irradiation is not more than 400 MPa, and the elongation at break of the adhesive layer after the ultraviolet irradiation is not less than 16%.

Inventors:
NAKAMURA CHIE (JP)
TANAKA TOMOAKI (JP)
TOKUI SOTA (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2021/038724
Publication Date:
May 12, 2022
Filing Date:
October 20, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J133/04; C09J7/38; C09J175/04; C09J201/02; H01L21/301
Domestic Patent References:
WO2009110426A12009-09-11
Foreign References:
JP2009197248A2009-09-03
JP2010177699A2010-08-12
JP2008013692A2008-01-24
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: PRESSURE-SENSITIVE ADHESIVE TAPE AND PROCESSING METHOD

Next Patent: NANOPARTICLES, PHOTOACOUSTIC CONTRAST AGENT, PHOTODYNAMIC THERAPEUTIC AGENT, AND PHOTOTHERMAL THERAP...