Title:
PRESSURE-SENSITIVE ADHESIVE TAPE AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/097471
Kind Code:
A1
Abstract:
A pressure-sensitive adhesive tape comprising a substrate layer and a pressure-sensitive adhesive layer disposed on the substrate layer, wherein the pressure-sensitive adhesive layer comprises a photo-radical initiator and a polymer A having a polymerizable carbon double bond and brings about a difference │R0-R1│ of 20° or less, R0 being a content angle with water of a silicon wafer surface and R1 being a contact angle with water of the silicon wafer surface as measured after the pressure-sensitive adhesive layer is applied to the silicon wafer, allowed to stand for 24 hours, subsequently irradiated with ultraviolet, and then peeled off.
Inventors:
NAKAMURA CHIE (JP)
TANAKA TOMOAKI (JP)
TOKUI SOTA (JP)
HASUMI MIZUKI (JP)
TANAKA TOMOAKI (JP)
TOKUI SOTA (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2021/038723
Publication Date:
May 12, 2022
Filing Date:
October 20, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J133/04; C09J7/38; C09J175/04; C09J201/02; H01L21/301
Foreign References:
| JP2009197248A | 2009-09-03 | |||
| JP2010232629A | 2010-10-14 | |||
| JP2011089009A | 2011-05-06 | |||
| JP2010084047A | 2010-04-15 | |||
| JP2000281993A | 2000-10-10 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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