Title:
ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/061925
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive tape whereby dicing can be performed by preventing cut dust from adhering to semiconductor devices without implementing extra improvement of equipment and introducing extra consumables in semiconductor device processing. An adhesive tape (1) of the present invention is to be used for the purpose of fixing batch-encapsulated packages at the time of dividing the batch-encapsulated packages into individual packages by dicing the batch-encapsulated packages into individual packages. The adhesive tape has an ultraviolet curable adhesive layer (5) on a base material film (3), and the surface of the adhesive layer (5) prior to ultraviolet irradiation has a contact angle of 115° or less with respect to pure water, and a contact angle of 65° of less with respect to methylene iodine.
Inventors:
TAMAGAWA YURI (JP)
OTA SATOSHI (JP)
YABUKI AKIRA (JP)
HATTORI SATOSHI (JP)
OTA SATOSHI (JP)
YABUKI AKIRA (JP)
HATTORI SATOSHI (JP)
Application Number:
PCT/JP2012/077242
Publication Date:
May 02, 2013
Filing Date:
October 22, 2012
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01L21/301; B32B27/00; B32B27/32; C09J7/29; C09J201/00
Foreign References:
| JP2009074011A | 2009-04-09 | |||
| JP2010251722A | 2010-11-04 | |||
| JP2005174963A | 2005-06-30 | |||
| JP2008091765A | 2008-04-17 |
Attorney, Agent or Firm:
INOUE, SEIICHI (JP)
Seiichi Inoue (JP)
Seiichi Inoue (JP)
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Claims: