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Patent Searching and Data


Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2013/147569
Kind Code:
A1
Abstract:
The present application relates to an adhesive tape, a polishing pad, a method for manufacturing the polishing pad, a polishing apparatus, and a method for manufacturing a glass substrate. An illustrative adhesive tape can be an adhesive tape used as polishing material. The adhesive tape, for example, does not give rise to bubbles and can be effectively fixed on a surface plate, and has superb resistance against shearing forces applied during a polishing process such as by water and abrasives. Furthermore, the adhesive tape does not leave residues and can be easily discarded from a polishing pad carrier or a surface plate after polishing.

Inventors:
YANG SE WOO (KR)
CHANG SUK KY (KR)
PARK MIN SOO (KR)
Application Number:
PCT/KR2013/002702
Publication Date:
October 03, 2013
Filing Date:
April 01, 2013
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
B24B37/00; C03C19/00; C09J4/02; C09J7/20
Foreign References:
JP2004503619A2004-02-05
KR20090078614A2009-07-20
KR100840114B12008-06-19
KR20110049689A2011-05-12
KR20070063365A2007-06-19
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
특허법인 다나 (KR)
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