ADHESIVE TAPE - NITTO DENKO CORP

Title:

ADHESIVE TAPE

Document Type and Number:

WIPO Patent Application WO/2021/024849

Kind Code:

A1

Abstract:

This adhesive tape contains thermally expandable microspheres, the thermally expandable microspheres are configured from a shell and a volatile substance contained in the shell, and said shell is configured from a resin with a glass transition temperature (Tg) of 120 C° or higher. In one embodiment, the resin configuring the shell contains a constituent unit that has a carboxyl group.

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Inventors:

NAKAO KOTA (JP)
SOEJIMA KAZUKI (JP)

Application Number:

PCT/JP2020/028836

Publication Date:

February 11, 2021

Filing Date:

July 28, 2020

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

B32B27/00; C09J7/38; C09J11/08; C09J201/00

Domestic Patent References:

WO2010122942A1	2010-10-28
WO1999043758A1	1999-09-02
WO2004058910A1	2004-07-15

Foreign References:

JP2017185448A

2017-10-12

Other References:

"Polymer Handbook", 1999, JOHN WILEY SONS, INC.
"Material design and functionalization of pressure-sensitive adhesive (film/tape", 30 September 2009, TECHNICAL INFORMATION INSTITUTE CO., LTD.
"Plastic Hard Coat Material II", 2004, CMC PUBLISHING CO., LTD.
See also references of EP 4011614A4