ADHESIVE WITH PRESSURE ADJUSTMENT FUNCTION

WIPO Patent Application WO/2024/080240

A1

An adhesive with a pressure adjustment function according to the present invention is bonded to a resin adherend that has a vapor discharge port for the purpose of sealing the vapor discharge port. The adhesive force of this adhesive is decreased by the heat of the vapor discharged from the vapor discharge port, and this adhesive loses adhesion by the pressure of the vapor, thereby having the vapor discharged. This adhesive is capable of sealing the vapor discharge port again after the discharge of vapor, and does not require an external force for the re-sealing. This adhesive may contain a pressure-sensitive adhesive and a side-chain crystalline polymer which contains, as a monomer component, a (meth)acrylate that has a linear alkyl group having 12 to 30 carbon atoms.

JP2023086476	ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
JP2002309222	HEAT FORMABLE PRESSURE SENSITIVE ADHESIVE AND PRESSURE SENSITIVE ADHESIVE
JPS582825	[Title of the Invention] An olefin resin-metal adhesion structure and a manufacturing method for the same

KATO TAKUMI (JP)
SAKO KEISUKE (JP)

PCT/JP2023/036547

April 18, 2024

October 06, 2023

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NITTA CORP (JP)

C09J201/00; B65D81/34; C09J7/38; C09J133/06

JP3049451U	1998-06-09
JPH09251273A	1997-09-22
JP2000025849A	2000-01-25
US20140263292A1	2014-09-18

BUNA PATENT ATTORNEYS (JP)

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