Title:
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2024/080241
Kind Code:
A1
Abstract:
The present invention provides an electromagnetic shielding film in which the interlayer adhesion between an adhesive layer and a metal foil is unlikely to be destroyed even if the film is heated with reflow etc. The present invention relates to an electromagnetic wave shielding film characterized in that: the electromagnetic wave shielding film contains an adhesive layer including a resin, and a metal foil laminated on the adhesive layer; the moisture-vapor transmission of the metal foil is 0.40 g/(m2·day) or more; and the moisture content of the adhesive layer is 1.00% by weight of less.
Inventors:
YANAGI YOSHIHARU (JP)
TAJIMA HIROSHI (JP)
OOKURA KATSUMA (JP)
TAJIMA HIROSHI (JP)
OOKURA KATSUMA (JP)
Application Number:
PCT/JP2023/036551
Publication Date:
April 18, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K9/00; B32B15/08
Domestic Patent References:
| WO2014192494A1 | 2014-12-04 |
Foreign References:
| JP2016204628A | 2016-12-08 | |||
| JP2013105888A | 2013-05-30 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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