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Title:
AFFIXATION FILM FOR PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/009230
Kind Code:
A1
Abstract:
This affixation film 101 for a printed wiring board comprises a circuit pattern hiding layer 112, and an adhesive layer 111 laminated with the circuit pattern hiding layer 112. The Rku of the surface of the circuit pattern hiding layer 112 on the opposite side from the adhesive layer 111 is 2.5-3.0 inclusive.

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Inventors:
ISHIOKA SOUGO (JP)
WATANABE MASAHIRO (JP)
Application Number:
PCT/JP2019/026844
Publication Date:
January 09, 2020
Filing Date:
July 05, 2019
Export Citation:
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Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H05K3/28; B32B27/00; C09J7/20; C09J7/29; C09J9/02; H05K9/00
Foreign References:
JP2014112576A2014-06-19
JP2014078574A2014-05-01
JP2018069459A2018-05-10
JP2015052025A2015-03-19
JP2015083379A2015-04-30
JP6426865B12018-11-21
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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