ADHESIVE FILM FOR PRINTED WIRING BOARD - TATSUTA ELECTRIC WIRE & CABLE CO LTD

Title:

ADHESIVE FILM FOR PRINTED WIRING BOARD

Document Type and Number:

WIPO Patent Application WO/2020/009229

Kind Code:

A9

Abstract:

This printed wiring board adhesive film comprises an bonding agent layer 111, and an insulating protective layer 112. With the insulating protective layer 112, the load area ratio (Smr2) separating a projection valley part and a core part is 91% or less.

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Inventors:

WATANABE MASAHIRO (JP)

Application Number:

PCT/JP2019/026843

Publication Date:

March 05, 2020

Filing Date:

July 05, 2019

Export Citation:

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Assignee:

TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)

International Classes:

H05K3/28; B32B3/30; B32B27/00; C09J7/20; C09J7/29; C09J9/02; H05K9/00

Attorney, Agent or Firm:

MAEDA & PARTNERS (JP)

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